Our cryogenic dielectric etch technology—Lam Cryo 3.0—delivers enhanced etch rates, vertical high aspect ratio (HAR) profiles, and more. Learn how Lam Cryo 3.0 is optimized to manufacture next-generation 3D NAND devices with 400 layers and beyond from Group VP and GM of Etch Product Group, Harmeet Singh. https://bit.ly/3yCkBVv | Lam Research Corporation
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As 3D NAND technology advances, the demand for greater deposition and etch intensity grows. Adding more memory layers requires not only innovative engineering but also precise material deposition and enhanced etch techniques. See how applying stress-compensating materials and leveraging molybdenum for improved conductivity ensure reliable scaling and more in the video below. | Lam Research Corporation
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Explore the etch precision and performance of our most advanced conductor etch technology to date. Akara® eliminates the bottleneck of slow plasma response by leveraging solid-state technology to enable precision, repeatability, and productivity. https://bit.ly/3Xq1Pdb | Lam Research Corporation
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Plasma etch: where science meets precision. Using plasma, chipmakers can carve microscopic patterns on a wafer. Learn how our plasma etch systems define the pathways that bring advanced technology to life. https://bit.ly/4mji5qd | Lam Research Corporation
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With ALTUS® Halo, chipmakers gain a solution designed for the next era of metallization, delivering consistent, atomic-level molybdenum deposition to support the most advanced device architectures. The video breaks it down. | Lam Research Corporation
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