The land grid array (LGA) is a type of surface-mount packaging for integrated circuits (ICs) that is notable for having the pins on the socket (when a socket is used) — as opposed to pins on the …

Nov 24, 2025 · Land Grid Array (LGA) is a common surface-mount packaging form and is widely used in integrated circuits (IC). It is particularly suitable for devices with high requirements for …

NXP offers industry standard LGA sizes and thicknesses with various options of input/output quantity and pitch. Package sizes range from 2 × 2 mm to 27 × 27 mm, with ball pitch ranging …

LGA stands for "Land Grid Array". Land Grid Array (LGA) is a package in which the lands are arranged in a grid pattern on the bottom of the package. Land Grid Array (LGA) is suitable for …

Sep 20, 2024 · A land grid array (LGA) is a type of electronic packaging technology used for mounting and interconnecting microprocessors, CPU, and other electronic components on a …

Land Grid Array (LGA) is a laminate substrate-based package that uses metal pads for external electrical connection instead of solder balls (as in the ball grid array). These metal pads, which …

Nov 2, 2025 · LGA, or Land Grid Array, is a type of integrated circuit packaging technology used in modern computer hardware. In an LGA package, the pins are located on the socket rather …

Land grid array(LGA) are molded array packages based on laminate interposer, which have an external pin or I/O on the bottom of the package arranged in columns and rows as shown in …

Aug 18, 2023 · The choice between LGA (Land Grid Array) and BGA (Ball Grid Array) surface-mount technologies depends on several factors and considerations specific to the application …

Aug 12, 2025 · Land Grid Array (LGA) is a type of packaging technology used to connect chips to a circuit board. It uses flat metal pads arranged in a grid, which are more durable than the pins …