The following text will discuss the different theoretical and mathematical principles working behind geometry processing. It will also discuss how they are applied to different purposes while ...

It may contain inaccuracies due to the limitations of machine translation. A research team led by Professor Ali Javey of the Department of Electrical Engineering and Computer Sciences at the ...

A new technical paper titled “Die-Level Transformation of 2D Shuttle Chips into 3D-IC for Advanced Rapid Prototyping using Meta Bonding” was published by researchers at Tohoku University.

3D micro-/nanofabrication holds the key to build a large variety of micro-/nanoscale materials, structures, devices, and systems with unique properties that do not manifest in their 2D planar ...