3D offers a new approach to meet the challenges faced by today's integrated circuits (IC) and information technology (IT). A 3D-ROM uses a 3D physical structure to extend the Moore's Law and is now in ...

Unlike scaling practices in 2D NAND technology, the direct way to reduce bit costs and increase chip density in 3D NAND is by adding layers. In 2013, Samsung shipped the first V-NAND product using 24 ...

Intel and Micron have unveiled what appears to be the holy grail of memory. Called 3D XPoint (pronounced “cross point”), this is an entirely new type of non-volatile memory, with roughly 1,000 times ...

“In-memory computing is an attractive alternative for handling data-intensive tasks as it employs parallel processing without the need for data transfer. Nevertheless, it necessitates a high-density ...

SEOUL, South Korea--(BUSINESS WIRE)--Samsung Electronics Co., Ltd., the world leader in advanced memory technology, today announced that it has begun mass producing the industry’s first 256-gigabit ...

Neo Semiconductor has announced the world’s first 3D stackable DRAM technology, called 3D X-DRAM, that could revolutionize computer memory. Neo estimates 3D X-DRAM can achieve 128Gb density with 230 ...

Companies Preview 10 th Generation 3D Flash Memory Technology Setting A New Benchmark for Performance, Power Efficiency and Bit Density SAN FRANCISCO--(BUSINESS WIRE)--Kioxia Corporation and Sandisk ...

SanDisk on Wednesday introduced an interesting new memory that could wed the capacity of 3D NAND and the extreme bandwidth enabled by high bandwidth memory (HBM). SanDisk's high-bandwidth flash (HBF) ...

"This is something many people thought was impossible," exclaimed Intel Senior Vice President Rob Crooke. During an invite-only press conference, Crooke along with Micron CEO Mark Durcan revealed a ...