Delivers an authentic listening experience by expressing the three elements of spatial reverberation, quietness, and dynamic range while preserving the natural “texture” of musical instruments Santa ...

A new technical paper titled “Die-Level Transformation of 2D Shuttle Chips into 3D-IC for Advanced Rapid Prototyping using Meta Bonding” was published by researchers at Tohoku University.

PSD@5KM+ expands ecosystem with co-working and talent development; 2nd batch of tech collaborators onboarded to expand IC ...

Rising memory prices are creating fresh cost challenges for IC design firms, particularly those producing chips with embedded ...