Ansys has collaborated with TSMC to ease the simulation and modeling of EM interactions on wireless ICs manufactured by TSMC. The Ansys multiphysics simulation platform works with TSMC’s N6RF Design ...

COMSOL version 6.0 delivers performance improvements and simplifies simulation of many important applications, such as printed circuit board (PCB) design (pictured). COMSOL Inc. (Burlington, Mass., ...

The term "multiphysics" applied to FEA software refers to the simultaneous combination of multiple physical models from different domains — such as fluid, structure, and chemical — to accurately ...

Today Comsol announced the availability of COMSOL Multiphysics software on the Rescale Cloud simulation platform. For customers seeking HPC resources for bigger analyses, this important initiative ...

The latest version of the multiphysics simulation software introduces GPU acceleration through NVIDIA CUDA’s direct sparse solver, the Granular Flow Module, and time-explicit structural dynamic ...

COMSOL, the leading provider of software solutions for multiphysics modelling and simulation, today made available the latest release of the COMSOL Multiphysics and COMSOL Server products. Version ...

Multiphysics simulation helps engineers understand the interaction of thermal, structural, acoustic, fluid, and electromagnetic effects in complex systems. Accurate material properties are crucial; ...

ANSYS Inc ANSS recently expanded its long-standing collaboration with TSMC to transform the semiconductor industry by leveraging artificial intelligence (AI) to advance multiphysics solutions to ...

Hyperscale datacenters are redefining the limits of data transmission technology, driven by increasing demands for higher bandwidth, lower power consumption, and reduced latency. Through advanced ...