Today’s fan-out wafer-level packaging (FOWLP) processes use organic substrates composed of epoxy mold compound (EMC) created using a thermal compression process. EMC wafers are a cost-effective way to ...

Dow Automotive Systems (Horgen, Switzerland) made big news at JEC Europe 2014 with the introduction of VORAFORCE, its ultralow-viscosity, fast-cure epoxy for automotive molding. Since then, says Peter ...

System-in-Package (SiP) technology has been used for a wide range of electronic devices, but the warpage behavior of the package can be difficult to control and predict due to complex manufacturing ...

Compression molded bulk carbon/epoxy molding compound costs significantly less than hand-layed sandwich construction because much of the latter’s touch labor is eliminated. The molding process enables ...

VANCOUVER, Wash.--(BUSINESS WIRE)--Kyocera Industrial Ceramics Corporation, Chemical Sales Division today announced the introduction of its new environmentally friendly XKE-G5633 Epoxy Molding ...

Bringing mass reduction capabilities to mass production facilities, Dow Automotive can now offer 90-second cycle times for resin transfer molding (RTM) with Voraforce 5300 resin matrix, making ...

In the fast-paced world of process engineering, process development is crucial to the success or failure of a plastic injection system. Solid processes must run at 100% efficiency with preferably zero ...

The global supply of epoxy molding compound for backend applications has fallen short of demand by 20% with delivery lead times extended further, according to industry sources. Sumitomo Bakelite, now ...