Flip chip packaging represents a cutting‐edge assembly technique in which semiconductor devices are mounted upside‐down, enabling direct connection to the substrate via solder bumps. This method not ...

Intel disclosed several chip packaging breakthroughs at the Electronic Components Technology Conference (ECTC), outlining the technical merits of multiple new chip packaging techniques. We spoke with ...

The chip manufacturing industry can be quite complex, and that’s normal. After all, there are multiple factors that go into the performance of a SoC, making it a success or directly ruining a good ...

Broadcom Inc. today detailed a new chip packaging technology, XDSiP, that makes it possible to create processors by stacking multiple silicon dies atop another. XDSiP is short for eXtreme Dimension ...

Apple has initiated early-stage discussions with select Indian semiconductor companies to explore the assembly and packaging of iPhone components, marking a potential milestone in India’s growing role ...

CoWoS shortages open the door for Chipzilla’s EMIB The dark satanic rumour mill has manufactured a hell on earth yarn ...

Intel's 14A process node and die-stacking EMIB are the favoured technologies.

TL;DR: NVIDIA's B300 AI chip production is accelerated to May, utilizing TSMC's advanced 5nm N4P process and CoWoS-L packaging. Featuring Bianca compute boards with 1 CPU and 2 GPUs, the B300 aims to ...

Artificial intelligence (AI) is reshaping the semiconductor landscape-both as a fast-growing end market and as a catalyst for innovation across mobile, automotive, networking, industrial and beyond.

The A20 chip widely expected to debut in the iPhone 18 Pro and folding iPhone will take advantage of a new packaging technique, on TSMC's 2nm chip fabrication technology. Rumors about the iPhone 18 ...

TL;DR: Apple has ordered next-gen M5 chips from TSMC for iPad Pro and Macs, with production in 2H 2025. The M5 chips will use TSMC's 3nm process and SoIC technology for better thermal management, with ...