3D sensing technology is rapidly being adopted in a variety of growing markets. End-product applications include smartphones, tablets, augmented/virtual reality products, robot vacuum cleaners, ...

Neubiberg, Germany — Infineon Technologies AG has announced a new family of RF power transistors in an open-cavity plastic package with a copper base, targeted at the high-volume cellular ...

The worldwide sensor market is growing by leaps and bounds. Indicative of that trend, analysts following large mainstream industries such as automotive manufacturers are now predicting that cars five ...

The company’s plastic air-cavity package for next-generation RF power transistors replaces conventional ceramic, enabling higher gain and output with weight and bill-of-materials savings The company’s ...

The quad flat no-leads (QFN) package is a low-cost, lead frame-based package that’s very common in the semiconductor industry. QFN packages have small footprints and adapt well to most silicon devices ...