It’s the tale of two promising and separate 3D chip architectures. One technology is slowly taking root, while the other one is heating up. 3D stacked-die using through-silicon vias (TSVs) is on the ...

3D NAND vendors face several challenges to scale their devices to the next level, but one manufacturing technology stands out as much more difficult at each turn—metrology. Metrology, the art of ...

SANTA CLARA, Calif., Feb. 28, 2023 (GLOBE NEWSWIRE) -- Applied Materials, Inc. today introduced a new eBeam metrology system specifically designed to precisely measure the critical dimensions of ...

(Nanowerk News) Nanotechnology and nanoscience are enabled by nanofabrication. Electron-beam lithography (EBL), which makes patterns down to a few nanometers, is one of the fundamental pillars of ...

Fabrication of 3D NAND devices involves a challenging and complex deposition and etch process. Two etch processes have been identified as substantially impacting 3D NAND product yields: silicon ...