Interposers are effectively platforms on which multiple components can be assembled — like a micro-sized PCB. The primary material today is silicon, and their sizes, even when built on older process ...
Amid the COVID-19 crisis, the global 3D IC and 2.5D IC Packaging Market estimated at USD 86.8 Billion in the year 2020, is projected to reach a revised size of USD 730 Billion by 2027, growing at a ...
2.5D and 3D Packaging Technology: The 2.5D and 3D packaging technologies encompass various packaging techniques. In 2.5D packaging, the choice of interposer material categorizes it into Si-based, ...
We're hearing the news from TheElec's sources, who said Samsung has ordered 16 units of the equipment from the packaging firm, with the South Korean giant receiving 7 of the units already, and will ...
The "Global 3D IC & 2.5D IC Packaging Market Analysis & Trends - Industry Forecast to 2027" report has been added to ResearchAndMarkets.com's offering. The Global 3D IC & 2.5D IC Packaging Market is ...
IC packaging has come into its own, where once traditional packaging was a “necessary evil,” today’s packaging can add significant value. There is an increase in functional density and flexibility by ...
Samsung Electronics is not only investing actively in the R&D and capacity expansion of high-bandwidth memory (HBM) technology, but also looking to broaden its market reach through customized one-stop ...
High-performance computing, 6G communication, autonomous vehicle chips, and consumer electronics are all key markets that benefit from advancing semiconductor packaging. IDTechEx's report, "Advanced ...
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